Content (Syllabus outline)

• Phenomenon of adhesion.
• Conventional cold and hot gluing.
• High-frequency gluing.
• Dielectric properties of materials.
• Innovative technologies of wood bonding.
• Green wood gluing.
• Welding of wood.
• Rheology of adhesives.
• Gelation and vitrification of adhesives, TTT.
• Kinetics and models of curing of thermosetting adhesives.
• Methods for monitoring adhesive cure (DSC, DMA, DEA).
• Development of adhesive bond strength (ABES).
• Quality of adhesive bonding.
• Strength and energy approach for determination of adhesive bond.
• Technology of bonding of wood with other materials (metal, polymers, glass, stone, ceramics).
• Adhesives for bonding of wood and non-wood materials
• Modelling and optimization of bonding process.
• Research and development in the field of adhesive bonding.

Prerequisites

1. Pogoji za vključitev v delo:

-   vpis v ustrezni letnik študijskega programa.

2. Pogoji za opravljanje študijskih obveznosti:

-   udeležba na vajah. Pogoj za pristop h kolokviju je 80% prisotnost na lab. vajah.

-   opravljen kolokvij iz vaj,

-   oddano poročilo,

-   opravljene vaje,

-   predstavitev seminarske naloge.

Pogoj za pristop k izpitu so pozitivno opravljene vaje ter opravljen seminar.